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½Å±â¼ú(Ultrasonic Flip Chip Bonding)
À» ÅëÇÑ ÀüÀÚºÎǰ, ûÁ¤±â¼ú °³¹ß |
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CMOS¼¾¼ ¸ðµâ»ç¾÷
Ä«¸Þ¶óÆù ¸ðµâ ÆÇ¸Å
CMOS Àû¿ë Á¦Ç° °³¹ß ¹× ÆÇ¸Å |
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UltraSonic
Bonding»ç¾÷
OLED, TFT-LCD, PDP°æ¹Ú´Ü¼ÒÇü ÀüÀÚºÎǰºÐ¾ß
½Å±â¼ú(Ultrasonic Flip Chip Bonding)À» ÅëÇÑ
ÀüÀÚºÎǰ, ûÁ¤±â¼ú °³¹ß |
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Â÷¼¼´ë ºÎǰ¼ÒÀç
(LED, LCDµî) |
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Â÷·®¿ë ºñÁ¯½Ã½ºÅÛ
ÇٽɸðµâÆÇ¸Å |
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Â÷¼¼´ë ûÁ¤±â¼ú
(Bonding, °øÁ¤¼³ºñ µî) |
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| Ãʹ̼¼ ÀüÀÚºÎǰ¿ë Â÷¼¼´ë Cooler °³¹ß ¹× ÆÇ¸Å |
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| ÃßÁøÈ°µ¿ |
| ȹ±âÀû Bonging °³¹ß |
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| ¾ç»ê±â¼úÀÇ ¼¼°èÈ |
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Ultrasonic Flip Chip Bonding
- Au-AuÁ¢ÇÕ
- COF (Chip on Film),
FOG (Film on Glass),
COG (Chip on Glass) µîÀÇ ÆÐŰ¡±â¼ú °³¹ß |
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| ¸ðµâ»ý»êÀ» À§ÇÑ ¾ç»ê½Ã¼³ È®º¸ |
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| ¿¬±¸¼Ò °ÇÃà ¹× µ¶¸³Ã¼»êÁ¦ ¿î¿ë |
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| ¼¼°èÀûÀÎ ½Å°ø¹ý 2Á¾ ÀÌ»ó ±Û·Î¹ú¸¶ÄÉÆÃÈ |
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Ultrasonic Flip Chip Bonding
- Au-AuÁ¢ÇÕ¿¡¼ ÀÌÁ¾ Á¢ÇÕ¹æ½Ä À¸·Î ¹ßÀü |
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¼¼°èÀû ½Å°ø¹ý ±Û·Î¹ú ¸¶ÄÉÆÃÈ |